It is suitable for acidic copper plating processes of high-end circuit boards (such as HDI, FPC, and IC substrates) with insoluble anodes, meeting the requirements of high-end manufacturing processes.

As a core raw material for acidic copper plating processes, it provides a stable source of Cu²⁺ ions for the plating bath. It is widely used in plastic electroplating, electroforming, surface finishing, PCB (Printed Circuit Board) manufacturing, electronic component production, electroless copper plating processes, as well as interconnection technologies and packaging processes in the microelectronics field.